DynaSprint: Microarchitectural Sprints with Dynamic Utility and Thermal Management

Ziqiang Huang, José A. Joao, Alejandro Rico, Andrew D. Hilton, Benjamin C. Lee. DynaSprint: Microarchitectural Sprints with Dynamic Utility and Thermal Management. In Proceedings of the 52nd Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2019, Columbus, OH, USA, October 12-16, 2019. pages 426-439, ACM, 2019. [doi]

@inproceedings{HuangJRHL19,
  title = {DynaSprint: Microarchitectural Sprints with Dynamic Utility and Thermal Management},
  author = {Ziqiang Huang and José A. Joao and Alejandro Rico and Andrew D. Hilton and Benjamin C. Lee},
  year = {2019},
  doi = {10.1145/3352460.3358301},
  url = {https://doi.org/10.1145/3352460.3358301},
  researchr = {https://researchr.org/publication/HuangJRHL19},
  cites = {0},
  citedby = {0},
  pages = {426-439},
  booktitle = {Proceedings of the 52nd Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2019, Columbus, OH, USA, October 12-16, 2019},
  publisher = {ACM},
  isbn = {978-1-4503-6938-1},
}