DynaSprint: Microarchitectural Sprints with Dynamic Utility and Thermal Management

Ziqiang Huang, José A. Joao, Alejandro Rico, Andrew D. Hilton, Benjamin C. Lee. DynaSprint: Microarchitectural Sprints with Dynamic Utility and Thermal Management. In Proceedings of the 52nd Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2019, Columbus, OH, USA, October 12-16, 2019. pages 426-439, ACM, 2019. [doi]

Abstract

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