Clement Huang, Alex Juan, K. C. Su. Stress Induced Voiding Behavior of Electroplated Copper Thin Films in Highly Scaled Cu/low-k interconnects. In 2020 IEEE International Reliability Physics Symposium, IRPS 2020, Dallas, TX, USA, April 28 - May 30, 2020. pages 1-3, IEEE, 2020. [doi]
@inproceedings{HuangJS20,
title = {Stress Induced Voiding Behavior of Electroplated Copper Thin Films in Highly Scaled Cu/low-k interconnects},
author = {Clement Huang and Alex Juan and K. C. Su},
year = {2020},
doi = {10.1109/IRPS45951.2020.9128844},
url = {https://doi.org/10.1109/IRPS45951.2020.9128844},
researchr = {https://researchr.org/publication/HuangJS20},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {2020 IEEE International Reliability Physics Symposium, IRPS 2020, Dallas, TX, USA, April 28 - May 30, 2020},
publisher = {IEEE},
isbn = {978-1-7281-3199-3},
}