Xiaohua Huang, Horacio Londoño-Ramírez, Marco Ballini, Chris Van Hoof, Jan Genoe, Sebastian Haesler, Georges G. E. Gielen, Nick Van Helleputte, Carolina Mora Lopez. A 256-Channel Actively-Multiplexed µECoG Implant with Column-Parallel Incremental ΔΣ ADCs Employing Bulk-DACs in 22-nm FDSOI Technology. In IEEE International Solid-State Circuits Conference, ISSCC 2022, San Francisco, CA, USA, February 20-26, 2022. pages 200-202, IEEE, 2022. [doi]
@inproceedings{HuangLBHGHGHL22,
title = {A 256-Channel Actively-Multiplexed µECoG Implant with Column-Parallel Incremental ΔΣ ADCs Employing Bulk-DACs in 22-nm FDSOI Technology},
author = {Xiaohua Huang and Horacio Londoño-Ramírez and Marco Ballini and Chris Van Hoof and Jan Genoe and Sebastian Haesler and Georges G. E. Gielen and Nick Van Helleputte and Carolina Mora Lopez},
year = {2022},
doi = {10.1109/ISSCC42614.2022.9731630},
url = {https://doi.org/10.1109/ISSCC42614.2022.9731630},
researchr = {https://researchr.org/publication/HuangLBHGHGHL22},
cites = {0},
citedby = {0},
pages = {200-202},
booktitle = {IEEE International Solid-State Circuits Conference, ISSCC 2022, San Francisco, CA, USA, February 20-26, 2022},
publisher = {IEEE},
isbn = {978-1-6654-2800-2},
}