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Cross-Layer Dual Modular Redundancy Hardened Scheme of Flip-Flop Design Based on Sense-Amplifier

Zhengfeng Huang, Zian Su, Tianming Ni, Qi Xu, Haochen Qi, Yingchun Lu, Manzi Eric, Hui Xu. Cross-Layer Dual Modular Redundancy Hardened Scheme of Flip-Flop Design Based on Sense-Amplifier. Journal of Circuits, Systems, and Computers, 30(5), 2021. [doi]

Authors

Zhengfeng Huang

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Zian Su

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Tianming Ni

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Qi Xu

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Haochen Qi

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Yingchun Lu

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Manzi Eric

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Hui Xu

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