A Novel Multi-Pattern Solder Joint Simultaneous Segmentation Algorithm for PCB Selective Packaging Systems

Lei Huang 0008, Shibin Shen, Fei Xie, Jing Zhao, Jianing Han, Kai-Feng. A Novel Multi-Pattern Solder Joint Simultaneous Segmentation Algorithm for PCB Selective Packaging Systems. IJPRAI, 33(13), 2019. [doi]

Abstract

Abstract is missing.