Bo-Jr Huang, Alfred Tsai, Lear Hsieh, Kathleen Chang, C.-J. Tsai, Jia-Ming Chen, Eric Jia-Wei Fang, Sung S.-Y. Hsueh, Jack Ciao, Barry Chen, Chuck Chang, Ping Kao, Ericbill Wang, Harry H. Chen, Hugh Mair, Shih-Arn Hwang. A 5G Mobile Gaming-Centric SoC with High-Performance Thermal Management in 4nm FinFET. In IEEE International Solid- State Circuits Conference, ISSCC 2023, San Francisco, CA, USA, February 19-23, 2023. pages 40-41, IEEE, 2023. [doi]
@inproceedings{HuangTHCTCFHCCCKWCMH23,
title = {A 5G Mobile Gaming-Centric SoC with High-Performance Thermal Management in 4nm FinFET},
author = {Bo-Jr Huang and Alfred Tsai and Lear Hsieh and Kathleen Chang and C.-J. Tsai and Jia-Ming Chen and Eric Jia-Wei Fang and Sung S.-Y. Hsueh and Jack Ciao and Barry Chen and Chuck Chang and Ping Kao and Ericbill Wang and Harry H. Chen and Hugh Mair and Shih-Arn Hwang},
year = {2023},
doi = {10.1109/ISSCC42615.2023.10067271},
url = {https://doi.org/10.1109/ISSCC42615.2023.10067271},
researchr = {https://researchr.org/publication/HuangTHCTCFHCCCKWCMH23},
cites = {0},
citedby = {0},
pages = {40-41},
booktitle = {IEEE International Solid- State Circuits Conference, ISSCC 2023, San Francisco, CA, USA, February 19-23, 2023},
publisher = {IEEE},
isbn = {978-1-6654-9016-0},
}