Research on the high-speed pick and place device for die bonders

Hsing-Hsin Huang, Jay Wey. Research on the high-speed pick and place device for die bonders. In 8th IEEE International Conference on Control and Automation, ICCA 2010, Xiamen, China, June 9-11, 2010. pages 1683-1687, IEEE, 2010. [doi]

Authors

Hsing-Hsin Huang

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Jay Wey

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