Hsing-Hsin Huang, Jay Wey. Research on the high-speed pick and place device for die bonders. In 8th IEEE International Conference on Control and Automation, ICCA 2010, Xiamen, China, June 9-11, 2010. pages 1683-1687, IEEE, 2010. [doi]
@inproceedings{HuangW10a-1,
title = {Research on the high-speed pick and place device for die bonders},
author = {Hsing-Hsin Huang and Jay Wey},
year = {2010},
doi = {10.1109/ICCA.2010.5524300},
url = {http://dx.doi.org/10.1109/ICCA.2010.5524300},
researchr = {https://researchr.org/publication/HuangW10a-1},
cites = {0},
citedby = {0},
pages = {1683-1687},
booktitle = {8th IEEE International Conference on Control and Automation, ICCA 2010, Xiamen, China, June 9-11, 2010},
publisher = {IEEE},
isbn = {978-1-4244-5196-8},
}