A non-invasive material sensing system and its integrated interface circuits

Yang-Jing Huang, Heng-Ching Wu, Po-Shen Chen, Hsu-Tao Shen, Sheng-Yu Peng, Chii-Wann Lin. A non-invasive material sensing system and its integrated interface circuits. In IEEE International Symposium on Circuits and Systems, ISCAS 2017, Baltimore, MD, USA, May 28-31, 2017. pages 1-4, IEEE, 2017. [doi]

@inproceedings{HuangWCSPL17,
  title = {A non-invasive material sensing system and its integrated interface circuits},
  author = {Yang-Jing Huang and Heng-Ching Wu and Po-Shen Chen and Hsu-Tao Shen and Sheng-Yu Peng and Chii-Wann Lin},
  year = {2017},
  doi = {10.1109/ISCAS.2017.8051008},
  url = {https://doi.org/10.1109/ISCAS.2017.8051008},
  researchr = {https://researchr.org/publication/HuangWCSPL17},
  cites = {0},
  citedby = {0},
  pages = {1-4},
  booktitle = {IEEE International Symposium on Circuits and Systems, ISCAS 2017, Baltimore, MD, USA, May 28-31, 2017},
  publisher = {IEEE},
  isbn = {978-1-4673-6853-7},
}