Temperature-Aware Layer Assignment for Three-Dimensional Integrated Circuits

Shih-Hsu Huang, Hua-Hsin Yeh. Temperature-Aware Layer Assignment for Three-Dimensional Integrated Circuits. IEICE Transactions, 97-A(8):1699-1708, 2014. [doi]

Authors

Shih-Hsu Huang

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Hua-Hsin Yeh

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