Shih-Hsu Huang, Hua-Hsin Yeh. Temperature-Aware Layer Assignment for Three-Dimensional Integrated Circuits. IEICE Transactions, 97-A(8):1699-1708, 2014. [doi]
@article{HuangY14-8,
title = {Temperature-Aware Layer Assignment for Three-Dimensional Integrated Circuits},
author = {Shih-Hsu Huang and Hua-Hsin Yeh},
year = {2014},
url = {http://search.ieice.org/bin/summary.php?id=e97-a_8_1699},
researchr = {https://researchr.org/publication/HuangY14-8},
cites = {0},
citedby = {0},
journal = {IEICE Transactions},
volume = {97-A},
number = {8},
pages = {1699-1708},
}