Thermal-mechanical behavior of the bonding wire for a power module subjected to the power cycling test

T. Y. Hung, S. Y. Chiang, C. J. Huang, C. C. Lee, K. N. Chiang. Thermal-mechanical behavior of the bonding wire for a power module subjected to the power cycling test. Microelectronics Reliability, 51(9-11):1819-1823, 2011. [doi]

Abstract

Abstract is missing.