Zongliang Huo, Weihua Cheng, Simon Yang. Unleash Scaling Potential of 3D NAND with Innovative Xtacking® Architecture. In IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), Honolulu, HI, USA, June 12-17, 2022. pages 254-255, IEEE, 2022. [doi]
@inproceedings{HuoCY22,
title = {Unleash Scaling Potential of 3D NAND with Innovative Xtacking® Architecture},
author = {Zongliang Huo and Weihua Cheng and Simon Yang},
year = {2022},
doi = {10.1109/VLSITechnologyandCir46769.2022.9830285},
url = {https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830285},
researchr = {https://researchr.org/publication/HuoCY22},
cites = {0},
citedby = {0},
pages = {254-255},
booktitle = {IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), Honolulu, HI, USA, June 12-17, 2022},
publisher = {IEEE},
isbn = {978-1-6654-9772-5},
}