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Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application

J. S. Hwang, M. J. Yim, K. W. Paik. Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application. Microelectronics Reliability, 48(2):293-299, 2008. [doi]

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