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Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer

Masayuki Ikebe, Daisuke Uchida, Yasuhiro Take, Makito Someya, Satoshi Chikuda, Kento Matsuyama, Tetsuya Asai, Tadahiro Kuroda, Masato Motomura. Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer. In Symposium on VLSI Circuits, VLSIC 2015, Kyoto, Japan, June 17-19, 2015. pages 82, IEEE, 2015. [doi]

Authors

Masayuki Ikebe

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Daisuke Uchida

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Yasuhiro Take

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Makito Someya

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Satoshi Chikuda

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Kento Matsuyama

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Tetsuya Asai

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Tadahiro Kuroda

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Masato Motomura

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