Masayuki Ikebe, Daisuke Uchida, Yasuhiro Take, Makito Someya, Satoshi Chikuda, Kento Matsuyama, Tetsuya Asai, Tadahiro Kuroda, Masato Motomura. Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer. In Symposium on VLSI Circuits, VLSIC 2015, Kyoto, Japan, June 17-19, 2015. pages 82, IEEE, 2015. [doi]
@inproceedings{IkebeUTSCMAKM15,
title = {Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer},
author = {Masayuki Ikebe and Daisuke Uchida and Yasuhiro Take and Makito Someya and Satoshi Chikuda and Kento Matsuyama and Tetsuya Asai and Tadahiro Kuroda and Masato Motomura},
year = {2015},
doi = {10.1109/VLSIC.2015.7231331},
url = {http://dx.doi.org/10.1109/VLSIC.2015.7231331},
researchr = {https://researchr.org/publication/IkebeUTSCMAKM15},
cites = {0},
citedby = {0},
pages = {82},
booktitle = {Symposium on VLSI Circuits, VLSIC 2015, Kyoto, Japan, June 17-19, 2015},
publisher = {IEEE},
isbn = {978-4-86348-502-0},
}