Toru Ikeda, Masatoshi Oka, Shinya Kawahara, Noriyuki Miyazaki, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada. Combination between the nonlinear finite element analyses and the strain measurement using the digital image correlation for a new 3D SIC package. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-6, IEEE, 2011. [doi]
Abstract is missing.