High frequency signal transmission characteristics of cone bump interconnections

A. Ikeda, N. Watanabe, T. Asano. High frequency signal transmission characteristics of cone bump interconnections. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-5, IEEE, 2011. [doi]

Abstract

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