Through Silicon Capacitive Coupling (TSCC) interface for 3D stacked dies

Katsuyuki Ikeuchi, Makoto Takamiya, Takayasu Sakurai. Through Silicon Capacitive Coupling (TSCC) interface for 3D stacked dies. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-5, IEEE, 2011. [doi]

Abstract

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