Virtualization-Based Efficient TSV Repair for 3-D Integrated Circuits

Muhammad Imran, Hyunseung Han, Jooho Kim, TaeHyun Kwon, Jaeyong Chung, Joon-Sung Yang. Virtualization-Based Efficient TSV Repair for 3-D Integrated Circuits. IEEE Access, 8:42231-42242, 2020. [doi]

Abstract

Abstract is missing.