T. Ishizaki, A. Kuno, A. Tane, M. Yanase, F. Osawa, T. Satoh, Y. Yamada. Reliability of Cu nanoparticle joint for high temperature power electronics. Microelectronics Reliability, 54(9-10):1867-1871, 2014. [doi]
@article{IshizakiKTYOSY14,
title = {Reliability of Cu nanoparticle joint for high temperature power electronics},
author = {T. Ishizaki and A. Kuno and A. Tane and M. Yanase and F. Osawa and T. Satoh and Y. Yamada},
year = {2014},
doi = {10.1016/j.microrel.2014.07.113},
url = {http://dx.doi.org/10.1016/j.microrel.2014.07.113},
researchr = {https://researchr.org/publication/IshizakiKTYOSY14},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {54},
number = {9-10},
pages = {1867-1871},
}