Reliability of Cu nanoparticle joint for high temperature power electronics

T. Ishizaki, A. Kuno, A. Tane, M. Yanase, F. Osawa, T. Satoh, Y. Yamada. Reliability of Cu nanoparticle joint for high temperature power electronics. Microelectronics Reliability, 54(9-10):1867-1871, 2014. [doi]

Abstract

Abstract is missing.