Young's modulus of a sintered Cu joint and its influence on thermal stress

T. Ishizaki, D. Miura, A. Kuno, K. Hasegawa, Masanori Usui, Y. Yamada. Young's modulus of a sintered Cu joint and its influence on thermal stress. Microelectronics Reliability, 76:405-408, 2017. [doi]

Abstract

Abstract is missing.