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Thermal Stress Analysis of Liquid-Cooled 3D-ICs

Sakib Islam, Ibrahim Abdel-Motaleb. Thermal Stress Analysis of Liquid-Cooled 3D-ICs. In 2020 IEEE International Conference on Electro Information Technology, EIT 2020, Chicago, IL, USA, July 31 - August 1, 2020. pages 132-135, IEEE, 2020. [doi]

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