Hiroyuki Ito, Hideyuki Sugita, Kenichi Okada, Tatsuya Ito, Kazuhisa Itoi, Masakazu Sato, Ryozo Yamauchi, Kazuya Masu. Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology. IEICE Transactions, 90-C(3):641-643, 2007. [doi]
@article{ItoSOIISYM07,
title = {Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology},
author = {Hiroyuki Ito and Hideyuki Sugita and Kenichi Okada and Tatsuya Ito and Kazuhisa Itoi and Masakazu Sato and Ryozo Yamauchi and Kazuya Masu},
year = {2007},
doi = {10.1093/ietele/e90-c.3.641},
url = {http://dx.doi.org/10.1093/ietele/e90-c.3.641},
researchr = {https://researchr.org/publication/ItoSOIISYM07},
cites = {0},
citedby = {0},
journal = {IEICE Transactions},
volume = {90-C},
number = {3},
pages = {641-643},
}