Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology - researchr publication

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Hiroyuki Ito, Hideyuki Sugita, Kenichi Okada, Tatsuya Ito, Kazuhisa Itoi, Masakazu Sato, Ryozo Yamauchi, Kazuya Masu. Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology. IEICE Transactions, 90-C(3):641-643, 2007. [doi]

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