Andrej Ivankovic, Kris Vanstreels, Daniel Vanderstraeten, Guy Brizar, Renaud Gillon, Eddy Blansaer, Bart Vandevelde. Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging. Microelectronics Reliability, 52(11):2677-2684, 2012. [doi]
@article{IvankovicVVBGBV12,
title = {Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging},
author = {Andrej Ivankovic and Kris Vanstreels and Daniel Vanderstraeten and Guy Brizar and Renaud Gillon and Eddy Blansaer and Bart Vandevelde},
year = {2012},
doi = {10.1016/j.microrel.2012.06.024},
url = {http://dx.doi.org/10.1016/j.microrel.2012.06.024},
researchr = {https://researchr.org/publication/IvankovicVVBGBV12},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {52},
number = {11},
pages = {2677-2684},
}