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Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging

Andrej Ivankovic, Kris Vanstreels, Daniel Vanderstraeten, Guy Brizar, Renaud Gillon, Eddy Blansaer, Bart Vandevelde. Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging. Microelectronics Reliability, 52(11):2677-2684, 2012. [doi]

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