Amdahl s figure of merit, SiGe HBT BiCMOS, and 3D chip stacking

Phil Jacobs, Aamir Zia, Okan Erdogan, Paul M. Belemjian, Peng Jin, Jin-Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald. Amdahl s figure of merit, SiGe HBT BiCMOS, and 3D chip stacking. In 25th International Conference on Computer Design, ICCD 2007, 7-10 October 2007, Lake Tahoe, CA, USA, Proceedings. pages 202-207, IEEE, 2007. [doi]

Abstract

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