Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling

S. Jacques, A. Caldeira, N. Batut, A. Schellmanns, R. Leroy, L. Gonthier. Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling. Microelectronics Reliability, 52(1):212-216, 2012. [doi]

Abstract

Abstract is missing.