Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications

Kyung Woon Jang, Chang-Kyu Chung, Woong-Sun Lee, Kyung-Wook Paik. Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications. Microelectronics Reliability, 48(7):1052-1061, 2008. [doi]

Abstract

Abstract is missing.