High-lead flip chip bump cracking on the thin organic substrate in a module package - researchr publication authors

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J. W. Jang, L. Li, P. Bowles, R. Bonda, D. R. Frear. High-lead flip chip bump cracking on the thin organic substrate in a module package. Microelectronics Reliability, 52(2):455-460, 2012. [doi]

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