J. W. Jang, L. Li, P. Bowles, R. Bonda, D. R. Frear. High-lead flip chip bump cracking on the thin organic substrate in a module package. Microelectronics Reliability, 52(2):455-460, 2012. [doi]
@article{JangLBBF12,
title = {High-lead flip chip bump cracking on the thin organic substrate in a module package},
author = {J. W. Jang and L. Li and P. Bowles and R. Bonda and D. R. Frear},
year = {2012},
doi = {10.1016/j.microrel.2011.09.024},
url = {http://dx.doi.org/10.1016/j.microrel.2011.09.024},
researchr = {https://researchr.org/publication/JangLBBF12},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {52},
number = {2},
pages = {455-460},
}