Modeling and Evaluation of the Interconnection-driven Repairability for Distributed Embedded Memory Cores on Chip

B. Jang, Nohpill Park, K. M. George, G. E. Hedrick. Modeling and Evaluation of the Interconnection-driven Repairability for Distributed Embedded Memory Cores on Chip. In M. H. Hamza, editor, Proceedings of the 22nd IASTED International Conference on Modelling, Identification, and Control (MIC 2003), February 10-13, 2003, Innsbruck, Austria. pages 403-408, IASTED/ACTA Press, 2003.

References

No references recorded for this publication.

Cited by

No citations of this publication recorded.