Failure analysis of contact probe pins for SnPb and Sn applications

Changsoo Jang, SeungBae Park, Bill Infantolino, Lawrence Lehman, Ryan Morgan, Dipak Sengupta. Failure analysis of contact probe pins for SnPb and Sn applications. Microelectronics Reliability, 48(6):942-947, 2008. [doi]

@article{JangPILMS08,
  title = {Failure analysis of contact probe pins for SnPb and Sn applications},
  author = {Changsoo Jang and SeungBae Park and Bill Infantolino and Lawrence Lehman and Ryan Morgan and Dipak Sengupta},
  year = {2008},
  doi = {10.1016/j.microrel.2008.03.015},
  url = {http://dx.doi.org/10.1016/j.microrel.2008.03.015},
  tags = {analysis},
  researchr = {https://researchr.org/publication/JangPILMS08},
  cites = {0},
  citedby = {0},
  journal = {Microelectronics Reliability},
  volume = {48},
  number = {6},
  pages = {942-947},
}