Imed Jani, Didier Lattard, Pascal Vivet, Edith Beigné. Innovative structures to test bonding alignment and characterize high density interconnects in 3D-IC. In 15th IEEE International New Circuits and Systems Conference, NEWCAS 2017, Strasbourg, France, June 25-28, 2017. pages 153-156, IEEE, 2017. [doi]
Abstract is missing.