3D stackable cryogenic InGaAs HEMTs for heterogeneous and monolithic 3D integrated highly scalable quantum computing systems - researchr publication authors

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JaeYong Jeong, Seong Kwang Kim, Jongmin Kim, Dae-Myeong Geum, Jisung Lee, Seung Young Park, SangHyeon Kim. 3D stackable cryogenic InGaAs HEMTs for heterogeneous and monolithic 3D integrated highly scalable quantum computing systems. In IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), Honolulu, HI, USA, June 12-17, 2022. pages 328-329, IEEE, 2022. [doi]

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