Songtao Jia, Min Miao, Runiu Fang, Shichao Guo, Duwei Hu, Yufeng Jin. A 3D micro-channel cooling system embedded in LTCC packaging substrate. In 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012, Kyoto, Japan, March 5-8, 2012. pages 649-652, IEEE, 2012. [doi]
@inproceedings{JiaMFGHJ12,
title = {A 3D micro-channel cooling system embedded in LTCC packaging substrate},
author = {Songtao Jia and Min Miao and Runiu Fang and Shichao Guo and Duwei Hu and Yufeng Jin},
year = {2012},
doi = {10.1109/NEMS.2012.6196859},
url = {http://dx.doi.org/10.1109/NEMS.2012.6196859},
researchr = {https://researchr.org/publication/JiaMFGHJ12},
cites = {0},
citedby = {0},
pages = {649-652},
booktitle = {7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012, Kyoto, Japan, March 5-8, 2012},
publisher = {IEEE},
isbn = {978-1-4673-1122-9},
}