Optimal wiring topology for electromigration avoidance considering multiple layers and obstacles

Iris Hui-Ru Jiang, Hua-Yu Chang, Chih-Long Chang. Optimal wiring topology for electromigration avoidance considering multiple layers and obstacles. In Prashant Saxena, Yao-Wen Chang, editors, Proceedings of the 2010 International Symposium on Physical Design, ISPD 2010, San Francisco, California, USA, March 14-17, 2010. pages 177-184, ACM, 2010. [doi]

@inproceedings{JiangCC10,
  title = {Optimal wiring topology for electromigration avoidance considering multiple layers and obstacles},
  author = {Iris Hui-Ru Jiang and Hua-Yu Chang and Chih-Long Chang},
  year = {2010},
  doi = {10.1145/1735023.1735064},
  url = {http://doi.acm.org/10.1145/1735023.1735064},
  researchr = {https://researchr.org/publication/JiangCC10},
  cites = {0},
  citedby = {0},
  pages = {177-184},
  booktitle = {Proceedings of the 2010 International Symposium on Physical Design, ISPD 2010, San Francisco, California, USA, March 14-17, 2010},
  editor = {Prashant Saxena and Yao-Wen Chang},
  publisher = {ACM},
  isbn = {978-1-60558-920-6},
}