Lin Jiang, Anthony Dowling, Yu Liu, Ming-C. Cheng. Exploring an Efficient Approach for Architecture-Level Thermal Simulation of Multi-core CPUs. In IEEE International Symposium on Circuits and Systems, ISCAS 2022, Austin, TX, USA, May 27 - June 1, 2022. pages 278-282, IEEE, 2022. [doi]
@inproceedings{JiangDLC22,
title = {Exploring an Efficient Approach for Architecture-Level Thermal Simulation of Multi-core CPUs},
author = {Lin Jiang and Anthony Dowling and Yu Liu and Ming-C. Cheng},
year = {2022},
doi = {10.1109/ISCAS48785.2022.9937274},
url = {https://doi.org/10.1109/ISCAS48785.2022.9937274},
researchr = {https://researchr.org/publication/JiangDLC22},
cites = {0},
citedby = {0},
pages = {278-282},
booktitle = {IEEE International Symposium on Circuits and Systems, ISCAS 2022, Austin, TX, USA, May 27 - June 1, 2022},
publisher = {IEEE},
isbn = {978-1-6654-8485-5},
}