Zhaoqi Jiang, Gui-Sheng Gan, Shi-Qi Chen, Qianzhu Xu, Tian Huang, Cong Liu, Peng Ma, Hao Yang, Siwen Chen, Yiping Wu. The effect of ultrasonic turn-on sequence for dual ultrasonicassisted soldering. In 2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021, Zhuhai, China, November 24-26, 2021. pages 163-166, IEEE, 2021. [doi]
Abstract is missing.