Li Jiang, Qiang Xu, Bill Eklow. On effective TSV repair for 3D-stacked ICs. In Wolfgang Rosenstiel, Lothar Thiele, editors, 2012 Design, Automation & Test in Europe Conference & Exhibition, DATE 2012, Dresden, Germany, March 12-16, 2012. pages 793-798, IEEE, 2012. [doi]
@inproceedings{JiangXE12,
title = {On effective TSV repair for 3D-stacked ICs},
author = {Li Jiang and Qiang Xu and Bill Eklow},
year = {2012},
url = {http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=6176602},
researchr = {https://researchr.org/publication/JiangXE12},
cites = {0},
citedby = {0},
pages = {793-798},
booktitle = {2012 Design, Automation & Test in Europe Conference & Exhibition, DATE 2012, Dresden, Germany, March 12-16, 2012},
editor = {Wolfgang Rosenstiel and Lothar Thiele},
publisher = {IEEE},
isbn = {978-1-4577-2145-8},
}