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On effective TSV repair for 3D-stacked ICs

Li Jiang, Qiang Xu, Bill Eklow. On effective TSV repair for 3D-stacked ICs. In Wolfgang Rosenstiel, Lothar Thiele, editors, 2012 Design, Automation & Test in Europe Conference & Exhibition, DATE 2012, Dresden, Germany, March 12-16, 2012. pages 793-798, IEEE, 2012. [doi]

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