Yield enhancement for 3D-stacked memory by redundancy sharing across dies

Li Jiang, Rong Ye, Qiang Xu. Yield enhancement for 3D-stacked memory by redundancy sharing across dies. In 2010 International Conference on Computer-Aided Design (ICCAD 10), November 7-11, 2010, San Jose, CA, USA. pages 230-234, IEEE, 2010. [doi]

@inproceedings{JiangYX10,
  title = {Yield enhancement for 3D-stacked memory by redundancy sharing across dies},
  author = {Li Jiang and Rong Ye and Qiang Xu},
  year = {2010},
  doi = {10.1109/ICCAD.2010.5654160},
  url = {http://dx.doi.org/10.1109/ICCAD.2010.5654160},
  tags = {redundancy},
  researchr = {https://researchr.org/publication/JiangYX10},
  cites = {0},
  citedby = {0},
  pages = {230-234},
  booktitle = {2010 International Conference on Computer-Aided Design (ICCAD 10), November 7-11, 2010, San Jose, CA, USA},
  publisher = {IEEE},
}