Li Jiang, Fangming Ye, Qiang Xu, Krishnendu Chakrabarty, Bill Eklow. On effective and efficient in-field TSV repair for stacked 3D ICs. In The 50th Annual Design Automation Conference 2013, DAC '13, Austin, TX, USA, May 29 - June 07, 2013. pages 74, ACM, 2013. [doi]
@inproceedings{JiangYXCE13,
title = {On effective and efficient in-field TSV repair for stacked 3D ICs},
author = {Li Jiang and Fangming Ye and Qiang Xu and Krishnendu Chakrabarty and Bill Eklow},
year = {2013},
doi = {10.1145/2463209.2488824},
url = {http://doi.acm.org/10.1145/2463209.2488824},
researchr = {https://researchr.org/publication/JiangYXCE13},
cites = {0},
citedby = {0},
pages = {74},
booktitle = {The 50th Annual Design Automation Conference 2013, DAC '13, Austin, TX, USA, May 29 - June 07, 2013},
publisher = {ACM},
isbn = {978-1-4503-2071-9},
}