Li Jiang, Fangming Ye, Qiang Xu, Krishnendu Chakrabarty, Bill Eklow. On effective and efficient in-field TSV repair for stacked 3D ICs. In The 50th Annual Design Automation Conference 2013, DAC '13, Austin, TX, USA, May 29 - June 07, 2013. pages 74, ACM, 2013. [doi]
Abstract is missing.