Quantification of creep strain in small lead-free solder joints with the in situ micro electronic-resistance measurement

Li Jiang, Keling Yang, Jiemin Zhou, Ke Xiang, Wenjie Wang. Quantification of creep strain in small lead-free solder joints with the in situ micro electronic-resistance measurement. Microelectronics Reliability, 48(3):438-444, 2008. [doi]

Authors

Li Jiang

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Keling Yang

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Jiemin Zhou

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Ke Xiang

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Wenjie Wang

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