Li Jiang, Keling Yang, Jiemin Zhou, Ke Xiang, Wenjie Wang. Quantification of creep strain in small lead-free solder joints with the in situ micro electronic-resistance measurement. Microelectronics Reliability, 48(3):438-444, 2008. [doi]
@article{JiangYZXW08,
title = {Quantification of creep strain in small lead-free solder joints with the in situ micro electronic-resistance measurement},
author = {Li Jiang and Keling Yang and Jiemin Zhou and Ke Xiang and Wenjie Wang},
year = {2008},
doi = {10.1016/j.microrel.2007.08.004},
url = {http://dx.doi.org/10.1016/j.microrel.2007.08.004},
researchr = {https://researchr.org/publication/JiangYZXW08},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {48},
number = {3},
pages = {438-444},
}