Thermal-Aware Placement and Routing for 3D Optical Networks-on-Chips - researchr publication authors

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Fengxian Jiao, Sheqin Dong, Bei Yu, Bing Li 0005, Ulf Schlichtmann. Thermal-Aware Placement and Routing for 3D Optical Networks-on-Chips. In IEEE International Symposium on Circuits and Systems, ISCAS 2018, 27-30 May 2018, Florence, Italy. pages 1-4, IEEE, 2018. [doi]

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